Closed · SFOP0003963 · CFDA 19.040 · Discretionary
2018 Young Southeast Asian Leaders Initiative Summit
Federal grant opportunity posted by Bureau of East Asian and Pacific Affairs, cataloged on Grants.gov.
- $500K-$600K
- Award range
- Closed
- Status
- April 16, 2018
- Close date
- 1
- Expected awards
The verdict
2018 Young Southeast Asian Leaders Initiative Summit is a closed discretionary listing from Bureau of East Asian and Pacific Affairs that offered $500,000 -- $600,000 across 1 expected award. Future funding cycles may be published under the same CFDA number. PlainGrants indexes 35 other opportunities from Bureau of East Asian and Pacific Affairs.
- $500K-$600K
- award range
- Closed
- application status
- 1
- expected award
- 19.040
- CFDA program
Archived opportunity record
2018 Young Southeast Asian Leaders Initiative… is closed (last close April 16, 2018). The parent program page for CFDA 19.040 is the reliable place to catch re-announcements. Bureau of East Asian and Pacific Affairs still indexes 35 other opportunities here.
According to Grants.gov (extract vintage 2026-08-10), this record reflects the officially published listing. See methodology.
Deadline tracker
Application window closed
Closed April 16, 2018
Est. Total Funding
$600,000
Expected Awards
1
Instrument
Grant
Description
The three-day YSEALI Summit, to be held in Singapore in early December 2018, will gather approximately 150 participants aged 18-35 around the theme "The United States and ASEAN: Partners in Growth and Innovation." The Summit, which this year marks YSEALI's fifth anniversary, will serve as a space for young innovators and entrepreneurs from both the United States and ASEAN to connect with U.S. companies and institutions focused on ASEAN. Throughout the Summit, participants will showcase projects, receive mentorship, explore opportunities to expand their work, exchange ideas on how to foster economic growth in their communities, and find avenues for stronger economic cooperation between the United States and ASEAN.
Catch-all / unrestricted eligibility mark · SFOP0003963
Grants.gov marks 2018 Young Southeast Asian Leaders Initiative… with a catch-all / unrestricted eligibility code (Others (see official listing text)). Read the official announcement text for the real applicant filter — the code alone is not a door list. The extract does not mark applicant cost-sharing as required. Instrument: Grant. Funding-activity code maps to Business and Commerce (BC). This eligibility-code string dominates the Bureau of East Asian and Pacific Affairs book (13 peers, 36% of 36).
- Code 25
- Others (see official listing text)
Codes are Grants.gov eligibility category values from the extract vintage 2026-08-10. Confirm the full eligibility statement on the official listing or the Grants.gov eligibility reference.
Official Listing on Grants.gov
View full details, application forms, and submission instructions.
Parent Grant Program
USAID International Development Grants
U.S. Department of State
Agency Contact
Kevin Schwartz SchwartzKM@state.gov
More from Bureau of East Asian and Pacific Affairs
What to do next
2018 Young Southeast Asian Leaders Initiative… is closed; use the parent program and agency catalog for the next funding cycle.
- Parent CFDA 19.040 may publish future NOFOs under the same assistance listing. Open program
- USAID International Development Grants indexes 47 Grants.gov listings in this extract. Program profile
- Bureau of East Asian and Pacific Affairs lists 35 other indexed opportunities on PlainGrants. Agency catalog
Opportunity deadlines and eligibility change on Grants.gov; PlainGrants mirrors the extract and is not the submission system.
Disclaimer: This information is sourced from Grants.gov and SAM.gov and is for informational purposes only. Opportunity details, deadlines, and eligibility requirements change frequently. Always verify current information directly on Grants.gov before applying. PlainGrants is not affiliated with any federal agency.
Read our methodology - how this data is sourced, computed, and verified.
| Publisher | PlainGrants |
| Sources | the SAM.gov Assistance Listings and Grants.gov |