Closed · SFOP0009975 · CFDA 19.322 · Discretionary
Diversifying Semiconductor Supply
Federal grant opportunity posted by Bureau of Economic and Business Affairs, cataloged on Grants.gov.
- $13.8M-$13.8M
- Award range
- Closed
- Status
- September 29, 2023
- Close date
- 1
- Expected awards
The verdict
Diversifying Semiconductor Supply is a closed discretionary listing from Bureau of Economic and Business Affairs that offered $13,800,000 -- $13,800,000 across 1 expected award. Future funding cycles may be published under the same CFDA number.
- $13.8M-$13.8M
- award range
- Closed
- application status
- 1
- expected award
- 19.322
- CFDA program
Opportunity snapshot. This Grants.gov announcement - Diversifying Semiconductor Supply - is cataloged under number SFOP0009975 and tied to CFDA assistance listing 19.322, posted by Bureau of Economic and Business Affairs. Grants.gov currently shows the opportunity as closed, first posted on July 25, 2023 and last updated on August 28, 2023. The funding category is Discretionary, delivered as a cooperative agreement.
Award economics. The award range on file is $13,800,000 -- $13,800,000. The agency has projected $13.8 million in total estimated funding for this announcement. It expects to issue 1 award. If the agency funds the expected 1 award from the $13.8 million estimated pool, the average award works out to roughly $13.8 million. Cost sharing is not required, so applicants do not need to commit matching funds to be competitive on this opportunity. Federal award ranges are often upper bounds; actual allocations reflect program appropriations, the strength of the applicant pool, and the evaluation committee's scoring.
Deadline and action path. This opportunity closed on September 29, 2023. Future funding cycles may be published under the same CFDA number, so monitoring the parent program page is the most reliable way to catch re-announcements. Every Grants.gov submission requires an active SAM.gov registration and a Unique Entity ID. Review the Eligibility section below carefully, federal eligibility categories (nonprofit, state or local government, tribal, individual, educational institution, small business) have distinct registration and reporting requirements. Pre-application outreach to the listed agency contact is permitted and often welcomed, it helps clarify scope and scoring priorities. Before acting on the deadline or award figures above, verify them directly on the official Grants.gov listing, amendments can change dates and amounts after this page was last refreshed.
Award Range
$13,800,000 -- $13,800,000
Close Date
September 29, 2023
Posted
July 25, 2023
Est. Total Funding
$13,800,000
Expected Awards
1
Instrument
Cooperative Agreement
Description
The Department of State’s Bureau of Economic and Business Affairs, Office of Multilateral Trade Affairs (EB/TPN/MTA) is pleased to announce a new funding opportunity through this Notice of Funding Opportunity (NOFO). Under this NOFO, EB/TPN/MTA seeks proposals to advance U.S. foreign policy and national security priorities outlined in the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act of 2022 (Div. A, P.L. 117-167). The Act established a new International Technology Security and Innovation Fund (ITSI Fund) “to support the development and adoption of secure semiconductors, [and] semiconductor supply chains” with the goal to make the global semiconductor supply chain more resilient, diversified, and secure. EB/TPN/MTA administers a portion of the ITSI funds to help expand international semiconductor assembly, testing, and packaging capacity that will in turn diversify the global semiconductor supply chain. The CHIPS Act legislated that ITSI must build diverse and resilient semiconductor supply chains for U.S.-based industry needs. The goal of this project is to bring that capacity online in ways that will be beneficial to the new U.S. semiconductor manufacturing facilities as well as our allies and partners. EB/TPN/MTA has identified the key regulatory and policy levers to attract semiconductor supply chain investments, identified workforce development needs, and on regulatory and infrastructure impediments. Programming to be funded with FY 2023 Economic Support Funds (ESF) will diversify and expand the semiconductor chip assembly, testing, and packaging (“ATP” or “downstream”) operations in key partner countries in the Americas and the Indo-Pacific region.
Eligibility
Grants.gov lists this opportunity under eligibility category code 12. These codes correspond to applicant types (state/local government, tribal organization, nonprofit, educational institution, individual, small business, etc.) defined in Grants.gov's own eligibility reference. See the current Grants.gov eligibility categories or check the official listing below for this opportunity's exact eligibility statement.
Official Listing on Grants.gov
View full details, application forms, and submission instructions.
Agency Contact
kentve@state.gov
Key Dates
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Disclaimer: This information is sourced from Grants.gov and SAM.gov and is for informational purposes only. Opportunity details, deadlines, and eligibility requirements change frequently. Always verify current information directly on Grants.gov before applying. PlainGrants is not affiliated with any federal agency.
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| Sources | the SAM.gov Assistance Listings and Grants.gov |